Semiconductor structure and manufacturing method thereof

ABSTRACT

A method of forming a semiconductor structure is provided. A layout of a substrate is provided. The layout includes a surface having an inner region and an outer region surrounding the inner region. An under bump metallurgy (UBM) pad region within the outer region is defined. The UBM pad region is partitioned into a first zone and a second zone, wherein the first zone faces towards a center of the substrate, and the second zone faces away from the center of the substrate. The substrate is provided according to the layout, wherein the providing of the substrate includes forming a conductive via in the substrate. The conductive via is disposed outside the second zone and at least partially overlaps the first zone from a top view perspective. A UBM pad is formed over the conductive via and within the UBM pad region.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a divisional application claiming priority to U.S.non-provisional application Ser. No. 15/960,222 filed Apr. 23, 2018, thedisclosure of which is hereby incorporated by reference in its entirety.

BACKGROUND

Electronic equipment using semiconductor structures is essential formany modern applications. With the advancement of electronic technology,semiconductor structures are becoming increasingly compact whileproviding expanded functionality and comprising greater amounts ofintegrated circuitry. With the expanded functionality and reduced scaleof the semiconductor structure, numerous manufacturing operations areimplemented with increased complexity.

The manufacturing of the semiconductor structure involves performance ofmany steps and operations on a compact semiconductor structure. Themanufacturing of the semiconductor structure with an increasedinterconnect density is becoming increasingly complicated. An increasein complexity of the manufacturing of the semiconductor structure mayresult in deficiencies such as degraded electrical performance or otherissues, resulting in a high yield loss of the semiconductor structureand an increase in manufacturing cost. Accordingly, there are manychallenges to be overcome in modifying the design and improving themanufacturing process of the semiconductor structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a schematic top view of a semiconductor structure inaccordance with some embodiments of the present disclosure.

FIG. 2 is a schematic cross-sectional view of a semiconductor structurein accordance with some embodiments of the present disclosure.

FIG. 3 is a plot showing a relationship between the geometry of asemiconductor structure and the geometry of an inner region within asurface of the semiconductor structure, in accordance with someembodiments of the present disclosure.

FIG. 4 is a flow chart showing a method of manufacturing a semiconductorstructure in accordance with some embodiments of the present disclosure.

FIGS. 5A to 5C are schematic diagrams of intermediate stages of themethod of FIG. 4 , in accordance with some embodiments of the presentdisclosure.

FIG. 6 is a plot showing a stress simulation result in accordance withsome embodiments of the present disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

In this document, the term “coupled” may also be termed as “electricallycoupled,” and the term “connected” may be termed as “electricallyconnected.” “Coupled” and “connected” may also be used to indicate thattwo or more elements cooperate or interact with each other.

Other features and processes may also be included. For example, testingstructures may be included to aid in the verification testing of 3Dpackaging or 3DIC devices. The testing structures may include, forexample, test pads formed in a redistribution layer or on a substratethat allows the testing of the 3D packaging or 3DIC device, the use ofprobes and/or probe cards, and the like. The verification testing may beperformed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

With the advancement of electronic technology, semiconductor or packagestructures are becoming increasingly compact while providing expandedfunctionality and comprising greater amounts of integrated circuitry. Inorder to further increase interconnect density or reduce theinterconnect length, several structures or layers may need to bedesigned in such a way as to overlap with one another. Conventionally,however, overlapping or intensive arrangements of structures havingdifferent values for properties such as stiffness or coefficient ofthermal expansion (CTE) may lead to unbalanced stress distribution,which is undesirable. Unbalanced stress distribution may result instructure damage, such as cracking or delamination, within thesemiconductor structure. Therefore, the above concerns and risks limitthe intensive or compact design for semiconductor structure.

For example, in a conventional wafer level chip scale packaging (WLCSP)product, a conductive via structure may be prevented from being disposeddirectly under an under bump metallurgy (UBM) pad structure. Since theconductive via structure may be under a high tensile stress region, thestress will be easily transmitted and will rise dramatically compared toa structure without a conductive via. Such stress transmission may leadto poor reliability or delamination of structures such as an extremelow-K (ELK) layer, a conductive via or an aluminum pad (AP). Therefore,according to typical design rules, a conductive via structure is notallowed to be disposed within the UBM pad edge. Conventionally althougha layout designer may wish to position a conductive via structure withincoverage of a UBM pad to achieve a compact structure, there is no clearmethod to define a keep-out zone for a conductive via structure.

In some embodiments, the present disclosure provides a semiconductorstructure in which a conductive via structure is disposed in a specifiedarea covered by a UBM pad in order to achieve a compact design whilemaintaining structural strength. In some embodiments, the presentdisclosure provides a method of manufacturing a semiconductor structurewherein a keep-out zone for a conductive via structure is defined, andthe conductive via structure may be disposed in a specified area withina covered area of a UBM pad range in order to save space. The presentdisclosure provides a keep-out zone for a conductive via structurewithin a UBM pad range in order to reduce the risk of ELK and Cu/Al paddelamination when there is no underfill structure. According to someembodiments of the present disclosure, a semiconductor structure can bedesigned to include an optimized via-available region, which a layoutdesigner may utilize in a design rule map.

In some embodiments of the present disclosure, a semiconductor structureis disclosed. The semiconductor structure includes a substrate, an underbump metallurgy (UBM) pad, and a conductive via. The substrate has asurface. The surface has an inner region and an outer region surroundingthe inner region. The UBM pad is on the surface and within the outerregion, and has a first zone and a second zone. The conductive via isunder the surface, outside the second zone, and at least partiallyoverlaps the first zone from a top view perspective. The first zonefaces towards a center of the surface, and the second zone faces awayfrom the center of the surface.

In some embodiments of the present disclosure, the semiconductorstructure includes a substrate, a UBM pad, and a conductive via. Thesubstrate has a surface. The surface has an inner region and an outerregion surrounding the inner region. The UBM pad is on the surface andwithin the outer region, and has a first zone and a second zone. Theconductive via is under the surface, and at least partially overlaps thefirst zone from a top view perspective. The first zone faces towards acenter of the surface, and the second zone faces away from the center ofthe surface. A portion of the conductive via overlapping the first zonefrom a top view perspective is larger than a portion of the conductivevia overlapping the second zone from a top view perspective.

FIG. 1 is a top view of a semiconductor structure 1 in accordance withsome embodiments of the present disclosure. FIG. 2 is a cross-sectionalview taken along sectional line AA across an exemplary UBM pad 220A ofthe semiconductor structure 1, in accordance with some embodiments ofthe present disclosure. Some features of FIG. 2 , such as conductivebumps 300, are not shown in FIG. 1 for clarity. Referring to FIGS. 1 and2 , the semiconductor structure 1 includes a substrate 100 and severalUBM pads 200. As shown in FIG. 2 , the substrate 100 has a surface 110.The UBM pads 200 are disposed on the surface 110.

In some embodiments, the semiconductor structure 1 is part of asemiconductor package. In some embodiments, the semiconductor structure1 is a multi-dimensional package such as a three-dimensional (3D)package. In some embodiments, the semiconductor structure 1 is a part ofan integrated fan-out (InFO) package. In some embodiments, thesemiconductor structure 1 is a part of a chip on wafer (CoW) structure,a chip on wafer on substrate (CoWoS) structure, or a wafer level chipscale package (WLCSP).

In some embodiments, the substrate 100 is fabricated with apredetermined functional circuit thereon. In some embodiments, thesubstrate 100 includes several conductive lines and several electricalcomponents such as transistor, diode, etc. connected by the conductivelines. In some embodiments, the substrate 100 is a semiconductivesubstrate. In some embodiments, the substrate 100 includes an interposeror a wafer. In some embodiments, the substrate 100 includes a siliconsubstrate or silicon wafer. In some embodiments, the substrate 100 canbe a printed circuit board (PCB).

In some embodiments, the substrate 100 includes a semiconductivematerial such as silicon, germanium, gallium, arsenic, or combinationsthereof. In some embodiments, the substrate 100 includes material suchas ceramic, glass, organic material, etc. In some embodiments, thesubstrate 100 includes a glass substrate or a glass wafer. In someembodiments, the substrate 100 has a quadrilateral, rectangular, square,polygonal or any other suitable shape. In some embodiments, the surface110 is a front surface or an active surface where the circuits aredisposed. In some embodiments, some conductors such as conductive bumpsor metallic pads (not shown) are disposed in the vicinity of the secondsurface 220 for electrical connection with external components such asanother PCB.

Referring to FIG. 1 , in some embodiments, an inner region 112 and anouter region 114 are defined on the surface 110 of the substrate 100. Inthe embodiment shown in FIG. 1 , the outer region 114 surrounds theinner region 112. In some embodiments, the outer region 114 borders theinner region 112 with a boundary 110B. In some embodiments, the outerregion 114 is a peripheral region of the substrate 100. The boundary110B is an outline or periphery of the inner region 112. The surface 110has a geometric center 110C. The center 110C is also the center of theinner region 112. In some embodiments, the outer region 114 includes theentire area of the surface 110 other than the inner region 112.

The UBM pads 200 on the surface 110 include several UBM pads 210 andseveral UBM pads 220. The UBM pads 210 are disposed in the inner region112 and the UBM pads 220 are disposed in the outer region 114. As shownin FIG. 1 , the surface of each UBM pad 220 defines a first zone 222(indicated by shaded regions or dotted patterns within the UBM pad 200)and a second zone 224 (indicated by white regions within the UBM pad200). The first zone 222 contacts the second zone 224. The first zone222 faces towards the center 110C of the surface 110, and the secondzone 224 faces away from the center 1100 of the surface 110. As such,the first zone 222 and second zone 224 of each UBM pad 220 have specificorientations according to the position of their respective UBM pad 220on the substrate 100. Each UBM pad 220 has a boundary line 220B betweenthe first zone 222 and the second zone 224. As shown in FIG. 1 , theboundary line 220B is perpendicular to a normal line NL, where thenormal line NL may be representative of the orientation of the UBM pad220 and connects a center of the UBM pad 220 to the center 1100 of thesurface 110. As such, the boundary line 2203 of each UBM pad 220 has acorresponding orientation according to the position of the respectiveUBM pad 220 in the outer region 114. In some embodiments, in eachcombination of the first zone 222 and second zone 224 of a UBM pad 220,the distance from the first zone 222 to the geometric center 1100 isless than the distance from the second zone 224 to the geometric center110C.

In FIG. 1 , there are twelve UBM pads 220 shown in the outer region. 114and four UBM pads 210 shown in the inner region 112. However, thepresent disclosure is not limited thereto. The number or arrangement ofthe UBM pads 220 or the UBM pads 210 can be adjusted according todifferent designs. In some embodiments, there may be no UBM pads 210,that is, all UBM pads 200 are within the outer region 114. In someembodiments, the arrangement of the UBM pads 210 or the UBM pads 220 maybe symmetric or asymmetric on the surface 110.

In some embodiments, the UBM pads 200 are disposed on the surface 110 byelectroplating. In some embodiments, the UBM pads 200 include aconductive material such as gold, silver, copper, nickel, tungsten,aluminum, and/or alloys thereof. The UBM pad 200 may have a solderablesurface which is exposed through the surface 110 for receiving aconductive bump that electrically connects the UBM pad 200 to acircuitry or another substrate external to the substrate 100. As shownin FIG. 2 , in some embodiments, one UBM pad 200 is configured forreceiving a conductive bump 300. The conductive bump 300 may includecopper, tin, lead or other metal. The UBM pad 200 may be bonded with theconductive bump 300 using a thermal treatment such as a reflow process.

In some embodiments, as shown in FIG. 2 , the substrate 1 includes aconductive via 120, a semiconductor die 180, an ELK layer 130, aconductive pad 140, a first insulation layer 150, a redistribution layer(RDL) 160 and a second insulation layer 170. The conductive via 120 isdisposed under the surface 110. In some embodiments, the conductive via120 is disposed under a UBM pad 200. The conductive via 120 may beexposed through the surface 110 and disposed under any one of the UBMpads 200 shown in FIG. 1 .

The semiconductor die 180, the ELK layer 130, the first insulation layer150, the RDL 160 and the second insulation layer 170 may be part of thesubstrate 100. In some embodiments, the semiconductor die 180 comprisessemiconductive materials such as silicon, and the semiconductor die 180is fabricated with a predetermined functional circuit included withinthe semiconductor die 180, wherein the predetermined functional circuitis produced by operations such as photolithography, etching, deposition,or other operations. In some embodiments, the semiconductor die 180 issingulated from a silicon wafer by a mechanical blade or a laser blade.In some embodiments, the semiconductor die 180 is a chip, a device, orthe like. In some embodiments, the semiconductor die 180 comprises avariety of electrical circuits suitable for a particular application. Insome embodiments, the electrical circuits include various devices suchas transistors, capacitors, resistors, diodes, and/or other devices. Insome embodiments, the semiconductor die 180 has a quadrilateral, arectangular or a square shape when viewed from above.

In some embodiments, the ELK layer 130 is disposed over thesemiconductor die 180. In some embodiments, the ELK layer 130 isdisposed on and in contact with the semiconductor die 180. In someembodiments, the ELK layer 130 is an inter-metal dielectric (IMD) layerand comprises a dielectric material such as nitride or oxide. In someembodiments, the ELK layer 130 has a dielectric value (k-value) lessthan 3.8. In some embodiments, the ELK layer 130 has a dielectric value(k-value) less than 3.0.

In some embodiments, the first insulation layer 150 is disposed over theELK layer 130. In some embodiments, the first insulation layer 150 isdisposed on and in contact with the ELK layer 130. In some embodiments,the second insulation layer 170 is disposed over the first insulationlayer 150. In some embodiments, the second insulation layer 170 isdisposed on and in contact with the first insulation layer 150. In someembodiments, at least one of the first insulation layer 150 and thesecond insulation layer 170 includes a dielectric material, such aspolyimide (PI), polybenzoxazole (PBO), benzocyclobuten (BCB), epoxy, orthe like.

In some embodiments, the conductive pad 140 is disposed between thesemiconductor die 180 and the conductive via 120. In some embodiments,the conductive pad 140 is electrically connected to the semiconductordie 180 and the conductive via 120. In some embodiments, the conductivepad 140 is at least partially covered by the first insulation layer 150.In some embodiments, the conductive pad 140 is at least partiallysurrounded by the first insulation layer 150. In some embodiments, aportion of the conductive pad 140 is exposed through the firstinsulation layer 150 and is in contact with the conductive via 120. Insome embodiments, the conductive pad 140 has a cylindrical,hemispherical or spherical shape. In some embodiments, the conductivepad 140 includes gold, silver, copper, nickel, tungsten, aluminum,titanium, palladium and/or alloys thereof.

In some embodiments, the conductive via 120 is disposed on theconductive pad 140. In some embodiments, the conductive via 120 iselectrically connected to the RDL 160. In some embodiments, theconductive via 120 is part of the RDL 160 and includes a verticalportion extending through the first insulation layer 150 and the secondinsulation layer 170. In some embodiments, the conductive via 120 andthe RDL 160 are integrally formed in the same process, such as a platingprocess. In some embodiments, the conductive via 120 or the RDL 160 isat least partially surrounded by the first insulation layer 150 or thesecond insulation layer 170. In some embodiments, the conductive via 120or the RDL 160 is at least partially covered by the second insulationlayer 170. In some embodiments, a portion of the conductive via 120 or aportion of the RDI, 160 is exposed through the second insulation layer170 and is in contact with the UBM 200. The UBM pad 200 may beconfigured to conductively couple the conductive via 120 or the RDL 160to the conductive bump 300.

Referring to FIGS. 1 and 2 , in some embodiments, the conductive via 120is coupled to the UBM pad 220 at a location outside the second zone 224from a top view perspective. In some embodiments, there is no conductivevia structure within the area covered by the second zone 224, asillustrated by the UBM 220A of FIG. 1 . In some embodiments, theconductive via 120 at least partially overlaps the first zone 222 of oneUBM pad 220, such as UBM pad 220B, from a top view perspective. In someembodiments, there are several conductive vias 120 at least partiallyoverlapping, from a top view perspective, a first zone 222 of a UBM pad220, such as UBM pad 220C. In some embodiments, one or more conductivevias 120 at least partially overlap, from a top view perspective, a UBMpad 210, such as UBM pad 210A, in the inner region 112.

Referring to FIG. 2 , in some embodiments, the conductive via 120 atleast partially overlaps the ELK layer 130 from a top view perspective.In some embodiments, with further reference to the UBM pad 220A in FIG.1 , a portion of the first zone 222, a portion of the conductive via120, and a portion of the ELK layer 130 overlap each other from a topview perspective.

In some embodiments, as illustrated by the UBM pad 220B of FIG. 1 , theconductive via 120 partially overlaps the first zone 222 and the secondzone 224, and the portion of the conductive via 120 that overlaps thefirst zone 222 from a top view perspective is larger than the portion ofthe conductive via 120 that overlaps the second zone 224 from a top viewperspective. In some embodiments, the conductive via 120 is closer to anedge of the first zone 222 that faces towards the center 110C than to anedge of the second zone 224 that faces away from the center 110C.

In some embodiments, the relative distance between the geometric center(from a top view perspective) of each conductive via 120 and thegeometric center (from a top view perspective) of the respective UBM pad220 (i.e., the UBM pad 200 within the outer region 114) may be differentbased on the location of the UBM pad 220 on the substrate 100. In someembodiments, among the UBM pads 220 within the outer region 114, if aUBM pad 220 is disposed closer to the boundary or edge of the substrate100, then its corresponding conductive via 120 will be determined to befarther away from the boundary or edge of the substrate 100 while stillat least partially within the coverage of the first zone 222. In someembodiments, among the UBM pads 220 within the outer region 114, if aUBM pad 220 is disposed closer to the boundary or edge of the substrate100, then the geometric center of its corresponding conductive via 120will be determined to be farther away from the boundary or edge of thesubstrate 100 while still within the coverage of the first zone 222. Insome embodiments, among the UBM pads 220 within the outer region 114, ifa UBM pad 220 is disposed closer to the boundary or edge of thesubstrate 100, then the geometric center of its corresponding conductivevia 120 will be determined to be farther away from the geometric centerof the corresponding UBM pad 220 while the conductive via 120 may stillbe largely within the coverage of the first zone 222.

In some embodiments, each UBM pad 220 has a circular shape. Within eachUBM pad 220, the first zone 222 has a semicircular shape and accountsfor one half of the surface of the UBM pad 220, and the second zone 224has a semicircular shape and accounts for the other half of the surfaceof the UBM pad 220. An arc or curved edge of the semicircular shape ofthe first zone 222 faces towards the center 110C, and an arc or curvededge of the semicircular shape of the second zone 224 faces away fromthe center 110C. In some embodiments, the semicircular shape of thefirst zone 222 or the second zone 224 is aligned with a normal linedrawn from a center of the UBM pad 220 to the center 110C of the surface110. In some embodiments, the first zone 222 may have a quarter-circularshape and accounts for a quarter of the surface of the UBM pad 220, anda curved edge or an arc of the quarter-circular shape faces towards thecenter 110C.

Referring to FIG. 1 , in some embodiments, a relationship between theinner region 112 and the surface 110 is defined as follows:L _(K)≤0.1×L ^(1.8) , W _(K)≤0.1×W ^(1.8),wherein L_(K) is a length of the inner region 112, L is a length of thesurface 110, W_(K) is a width of the inner region 112, and W is a widthof the surface 110. In some embodiments, L is also a length of the outerregion 114, and W is also a width of the outer region 114.

FIG. 3 is a plot showing a relationship between the geometry of thesemiconductor structure 1 and the geometry of an inner region 112 of thesurface 110 of the semiconductor structure 1, in accordance with someembodiments of the present disclosure. As shown in FIG. 3 , L_(K) isabout 0.1×L^(1.8), and W_(K) is about 0.1×W^(1.8). For example, a chipwith a size of about 2.5 mm×2.5 mm may be defined with an inner region112 with a size of about 0.52 mm×0.52 mm.

In some embodiments, the inner region 112 is defined to be an allowableregion for conductive via arrangement. One or several conductive vias120 may be disposed within the inner region 112 and under one or moreUBM pads 210 within the inner region 112. The location of the conductivevia 120 within the range of a UBM pad 210 may not be limited. For eachUBM pad 220 that is outside the inner region 112 and within the outerregion 114, the first zone 222 and the second zone 224 are defined. Insome embodiments, the second zone 224 is defined to be a keep-out zonefor conductive vias. No conductive via is allowed in any portion of thesecond zone 224, and a conductive via 120 may be disposed to overlapwith the first zone 222, as described previously.

The present disclosure provides a better design for conductive viaarrangement in order to reduce stress suffered by structures such as theELK layer 130 or the conductive pad 140 during processes such as a ballmount process, a reflow process, or a surface mount technology (SMT)process. Some embodiments of the present disclosure arrange a conductivevia 120 outside the high tensile stress region while being within therange of a UBM pad 220. The present disclosure provides an optimized vialocation for a semiconductor structure such as a WLCSP.

During processes such as a ball mount process, a reflow process, or anSMT process of the semiconductor structure 1, CTE mismatch betweenstructures may lead to cracking or delamination. CTE mismatch may occurbetween structures such as the ELK layer 130, the conductive pad 140,the conductive via 120, the UBM pad 200, the conductive bump 300, oranother substrate connected to the UBM pad 200 by the conductive bump300. For example, during an SMT process, an area within the UBM pads 220in the outer region 114 suffers a greater stress than an area within theUBM pads 210 in the inner region. 112, which is the allowable region.That is because the stress resulting from CTE mismatch increases withthe distance between the pad and the center 110C. For each UBM pad 220,the first zone 222 suffers a compressive stress and the second zone 224suffers a tensile stress. Arranging a conductive via 120 within thetensile stress area may incur a higher risk of cracking or delaminationfor the ELK layer 130 or the Al pad below the UBM pad 220.

FIG. 4 is a flow chart of a method 4 for manufacturing a semiconductorstructure. The method 4 includes operations 401, 402, 403, 404, 405, and406. The order of operations illustrated in FIG. 4 is not limiting andserves as an embodiment only.

FIG. 5A illustrates the operations 401 and 402 in FIG. 4 . In operation401, a layout of a substrate 100 is provided. In operation 402, an innerregion 112 and an outer region 114 surrounding the inner region 112 aredefined in the layout of the substrate 100. In some embodiments, arelationship between the inner region 112 and the substrate 100 isdefined as follows:L _(K)≤0.1×L ^(1.8) , W _(K)≤0.1×W ^(1.8),wherein L_(K) is a length of the inner region 112, L is a length of thesubstrate 100, W_(K) is a width of the inner region 112, and W is awidth of the substrate 100. In some embodiments, L is also a length ofthe outer region 114, and W is also a width of the outer region 114. Insome embodiments, the substrate 100, the inner region 112 and the outerregion 114 have configurations similar to those of the componentsdescribed above or illustrated in FIG. 1 or FIG. 3 . As shown in FIG.5A, a center 110C is a center of the substrate 100.

FIG. 5B illustrates the operations 403 and 404 in FIG. 4 . In operation403, several UBM pad regions 200R are defined in the layout of substrate100. The UBM pad regions 200R include several UBM pad regions 210Rwithin the inner region 112 and several UBM pad regions 220R within theouter region 114. In operation 403, within each UBM pad region 220R, afirst zone 222R and a second zone 224R are defined. The first zone 222Rfaces towards the center 110C from a top view perspective, and thesecond zone 224R faces away from the center 110C from a top viewperspective. In some embodiments, the UBM pad regions 200R, the UBM padregions 210R, the UBM pad regions 220R, the first zone 222R, and thesecond zone 224R correspond respectively to the UBM pads 200, the UBMpads 210, the UBM pads 220, the first zone 222, and the second zone 224of FIG. 1 or FIG. 2 .

FIG. 5C illustrates the operations 405 and 406 of FIG. 4 . In operation405, the substrate 100 is provided or formed according to the layout ofsubstrate 100 defined in operations 401 through 404. In someembodiments, the substrate 100 includes a semiconductor die 180. Thesemiconductor die 180 may be formed using operations such aslithography, deposition, and etching. A singulation operation may beused to separate the substrate 100 into individual semiconductor dies180. In some embodiments, an ELK layer 130, a conductive pad 140, afirst insulation layer 150 and a second insulation layer 170 may besequentially formed over the semiconductor die 180. In some embodiments,a recess is formed in the second insulation layer 170. In someembodiments, the recess extends through the first insulation layer 150and exposes the conductive pad 140.

Subsequently, during the operation 405, the conductive via 120 is formedin the recess. The conductive via 120 is conductively coupled to theconductive pad 140. In some embodiments, the conductive via 120 isdisposed outside each second zone 224R. In some embodiments, theconductive via 120 at least partially overlaps a first zone 222R from atop view perspective. In operation 406, several UBM pads 200 are formedon the substrate 100 and within the UBM pad regions 200R. In someembodiments, the conductive via 120 and the UBM pad 200 haveconfigurations similar to those described above or illustrated in FIG. 2.

FIG. 6 shows a plot of a stress simulation result within a semiconductorstructure 1 in accordance with some embodiments of the presentdisclosure. The hatched areas ST indicate high stress areas, which arethe areas where the ELK layer suffers relatively high stress duringprocesses such as an SMT process, a ball mount process or a reliabilitytest. The length L of the surface 110 is 2.48 mm, the width W of thesurface 110 is 2.48 mm, the length L_(K) of the inner region 112 is 0.51mm, and the width W_(K) of the inner region 112 is 0.51 mm. The sizearrangement meets the criteria:L _(K)≤0.1×L ^(1.8) , W _(K)≤0.1×W ^(1.8),which is in accordance with some embodiments of the present disclosure.

As shown in FIG. 6 , the UBM pads 210 within the inner region 112 (whichis the allowable region for locations of conductive vias) do not includeany high stress area; therefore a conductive via may be disposed in anyposition within the range of a UBM pad 210. However, for each UBM pad220 in the outer region 114, a high stress area ST exists in the secondzone 224. A conductive via disposed within the second zone 224 may leadto damage of the ELK layer. Therefore, in some embodiments of thepresent disclosure, each second zone 224 is defined as a keep-out zonefor conductive vias. Furthermore, as shown in FIG. 6 , each UBM pad 210includes a first zone 222, which does not include a high stress area.Therefore, in some embodiments of the present disclosure, a conductivevia is allowed to at least partially overlap the first zone 222. Thisprovides a layout designer more flexibility to optimize a layout design.

Some embodiments of the present disclosure provide a method ofmanufacturing a semiconductor structure. A layout of a substrate isprovided. The layout includes a surface having an inner region and anouter region surrounding the inner region. An under bump metallurgy(UBM) pad region within the outer region is defined. The UBM pad regionis partitioned into a first zone and a second zone, wherein the firstzone faces towards a center of the substrate, and the second zone facesaway from the center of the substrate. The substrate is providedaccording to the layout, wherein the providing of the substrate includesforming a conductive via in the substrate. The conductive via isdisposed outside the second zone and at least partially overlaps thefirst zone from a top view perspective. A UBM pad is formed over theconductive via and within the UBM pad region.

Some embodiments of the present disclosure provide a method of forming asemiconductor structure. A substrate including a surface is provided.The surface has an inner region and an outer region surrounding theinner region. The providing of the substrate includes forming aconductive via and depositing a redistribution layer laterallysurrounding an upper surface of the conductive via. The redistributionlayer includes a top surface contacting the upper surface of theconductive via. An under bump metallurgy (UBM) pad is formed over thesubstrate within the outer region. The UBM pad has a first zone and asecond zone. The first zone faces towards a center of the surface andthe second zone faces away from the center of the surface. The UBM padoverlaps an entirety of an upper surface of the conductive via. Theconductive via overlaps the first zone with a first area and overlapsthe second zone with a second area less than the first area. The UBM padcontacts the top surface of the redistribution layer and the uppersurface of the conductive via.

Some embodiments of the present disclosure provide a method formanufacturing a semiconductor structure. A semiconductor die having asurface is provided. The surface includes an inner region and an outerregion surrounding the inner region. A conductive via is formed over thesurface. A redistribution layer is formed over the semiconductor die andadjacent to the conductive via. An insulation layer is formed over theredistribution layer and covering a top surface of the conductive via.An under bump metallurgy (UBM) pad is formed over the redistributionlayer and within the outer region. The UBM pad has a first zone and asecond zone. The first zone faces towards a center of the surface andthe second zone faces away from the center of the surface. The formingof the conductive via includes causing an entirety of the conductive viato be non-overlapped with the second zone from a top-view perspective.The redistribution layer laterally surrounds the conductive via. Theinsulation layer is arranged between the UBM pad and the redistributionlayer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother operations and structures for carrying out the same purposesand/or achieving the same advantages of the embodiments introducedherein. Those skilled in the art should also realize that suchequivalent constructions do not depart from the spirit and scope of thepresent disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

The invention claimed is:
 1. A method of manufacturing a semiconductorstructure, the method comprising: providing a layout of a substrate, thelayout including a surface having an inner region and an outer regionsurrounding the inner region; defining an under bump metallurgy (UBM)pad region within the outer region; partitioning the UBM pad region intoa first zone and a second zone, the first zone facing towards a centerof the substrate, and the second zone facing away from the center of thesubstrate; providing the substrate according to the layout, theproviding of the substrate comprising forming a conductive via in thesubstrate, the conductive via disposed outside the second zone and atleast partially overlapping the first zone from a top view perspective;and forming a UBM pad over the conductive via and within the UBM padregion.
 2. The method of claim 1, wherein the providing of the substratefurther comprising forming a conductive pad, wherein the conductive viais formed on the conductive pad.
 3. The method of claim 1, furthercomprising forming an insulation layer over the conductive via prior toforming the UBM pad, wherein the insulation layer covers a portion of anupper surface of the conductive via.
 4. The method of claim 1, whereinthe forming of the substrate further comprises forming a redistributionlayer prior to forming the insulation layer, wherein UBM pad contacts aportion the redistribution layer between the conductive via and theinsulation layer.
 5. The method of claim 4, wherein the redistributionlayer comprises a protrusion adjacent to the conductive via.
 6. Themethod of claim 1, wherein the inner region and the surface meet thefollowing relationship:L _(K)≤0.1×L ^(1.8) , W _(K)≤0.1×W ^(1.8), wherein L_(K) is a length ofthe inner region, L is a length of the surface, W_(K) is a width of theinner region, and W is a width of the surface.
 7. The method of claim 1,wherein the UBM pad has a circular shape, the first zone has a firstsemicircular shape and accounts for a first half of the UBM pad, and thefirst zone includes a curved edge of the first semicircular shape facingthe center of the surface.
 8. The method of claim 1, wherein the secondzone has a second semicircular shape and accounts a second half of theUBM pad, and the second zone includes a curved edge of the secondsemicircular shape facing away from the center.
 9. The method of claim1, wherein a boundary line between the first zone and the second zone isperpendicular to a line connecting a center of the UBM pad and thecenter of the surface.
 10. The method of claim 1, further comprisingforming a conductive bump on the UBM pad.
 11. A method of forming asemiconductor structure, the method comprising: providing a substratecomprising a surface, the surface having an inner region and an outerregion surrounding the inner region, the providing of the substratecomprising: forming a conductive via; and depositing a redistributionlayer laterally surrounding an upper surface of the conductive via,wherein the redistribution layer comprises a top surface contacting theupper surface of the conductive via; and forming an under bumpmetallurgy (UBM) pad over the substrate within the outer region, the UBMpad having a first zone and a second zone, the first zone facing towardsa center of the surface and the second zone facing away from the centerof the surface, wherein the UBM pad overlaps an entirety of an uppersurface of the conductive via, wherein the conductive via overlaps thefirst zone with a first area and overlaps the second zone with a secondarea less than the first area, wherein the UBM pad contacts the topsurface of the redistribution layer and the upper surface of theconductive via.
 12. The method of claim 11, wherein the forming of thesubstrate further comprises depositing an insulation layer surroundingthe conductive via, a portion of the conductive via exposed through theinsulation layer.
 13. The method of claim 11, wherein the UBM pad has acircular shape, the first zone has a first semicircular shape andaccounts for a first half of the UBM pad, and the first zone includes acurved edge of the first semicircular shape facing the center.
 14. Themethod of claim 11, wherein the second zone has a second semicircularshape and accounts for a second half of the UBM pad, and the second zoneincludes a curved edge of the second semicircular shape facing away fromthe center.
 15. The method of claim 11, wherein a boundary line betweenthe first zone and the second zone is perpendicular to a line connectinga center of the UBM pad and the center of the surface.
 16. The method ofclaim 11, wherein the substrate further comprises a semiconductor die,wherein the forming of the substrate further comprises forming aconductive pad over the semiconductor die, and semiconductive padconductively couples the semiconductor die to the conductive via. 17.The method of claim 16, wherein the forming of the substrate furthercomprises forming a dielectric layer over the semiconductor die and theconductive pad, wherein the dielectric layer covers at least a portionof a top surface of the conductive pad.
 18. The method of claim 16,wherein dielectric layer extends along a sidewall of the conductive via.19. A method of forming a semiconductor structure, the methodcomprising: providing a semiconductor die having a surface, the surfaceincluding an inner region and an outer region surrounding the innerregion; forming a conductive via over the surface; forming aredistribution layer over the semiconductor die and adjacent to theconductive via; forming an insulation layer over the redistributionlayer and covering a top surface of the conductive via; and forming anunder bump metallurgy (UBM) pad over the redistribution layer and withinthe outer region, the UBM pad having a first zone and a second zone, thefirst zone facing towards a center of the surface, and the second zonefacing away from the center of the surface, wherein the forming of theconductive via comprises causing an entirety of the conductive via to benon-overlapped with the second zone from a top-view perspective, whereinthe redistribution layer laterally surrounding the conductive via,wherein the insulation layer is arranged between the UBM pad and theredistribution layer.
 20. The method of claim 19, further comprisingforming a conductive pad over the semiconductor die, wherein theconductive via is formed on the conductive pad, and the conductive padis non-overlapped with the second zone from a top-view perspective.